A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid?liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu ...A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid?liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters (bonding temperature and preheating time) were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni?P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 ℃ for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29×10^5 S/cm, respectively.展开更多
The aim of this work was to evaluate the electrochemical behaviour of hypoeutectic Al-Cu alloys immersed in two different solutions containing sulphate and chloride ions, respectively. The influence of Al2Cu associate...The aim of this work was to evaluate the electrochemical behaviour of hypoeutectic Al-Cu alloys immersed in two different solutions containing sulphate and chloride ions, respectively. The influence of Al2Cu associated to the dendritic arm spacing on the general corrosion resistance of such alloys is analysed. The typical microstructural pattern was examined by using scanning electron microscope. The corrosion tests were performed in both 0.5 M sulphuric acid and 0.5 M NaCl solutions at 25℃ by using an electrochemical impedance spectroscopy (EIS) technique and potentiodynamic polarization curves. Equivalent circuits by using the ZView software, were also used to provide quantitative support for the discussions. It was found that as the Cu content increased (i.e., increasing the Al2Cu fraction), a higher susceptibility to the corrosion action in the NaCl solution is detected. In contrast, the tests carried out in the H2SO4 solution resulted in similar corrosion,rates for the three different hypoeutectic alloys.展开更多
基金Project(51571080)supported by the National Natural Science Foundation of China
摘要A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid?liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters (bonding temperature and preheating time) were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni?P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 ℃ for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29×10^5 S/cm, respectively.
摘要The aim of this work was to evaluate the electrochemical behaviour of hypoeutectic Al-Cu alloys immersed in two different solutions containing sulphate and chloride ions, respectively. The influence of Al2Cu associated to the dendritic arm spacing on the general corrosion resistance of such alloys is analysed. The typical microstructural pattern was examined by using scanning electron microscope. The corrosion tests were performed in both 0.5 M sulphuric acid and 0.5 M NaCl solutions at 25℃ by using an electrochemical impedance spectroscopy (EIS) technique and potentiodynamic polarization curves. Equivalent circuits by using the ZView software, were also used to provide quantitative support for the discussions. It was found that as the Cu content increased (i.e., increasing the Al2Cu fraction), a higher susceptibility to the corrosion action in the NaCl solution is detected. In contrast, the tests carried out in the H2SO4 solution resulted in similar corrosion,rates for the three different hypoeutectic alloys.
基金国家自然科学基金项目50971101和51074127凝固技术国家重点实验室自主研究课题项目34-TP-2009资助+1 种基金Supported by National Natural Science Foundation of China(Nos.50971101 and 51074127)Fund of State Key Laboratory of Solidification Processing in NWPU(No.34-TP-2009)