Bulk single-crystal aluminum nitride(BSC AlN)substrates are known to be ideal platforms for constructing highpower and DUV optoelectronic nitride devices.However,high-quality epitaxial growth of nitride films on BSC A...Bulk single-crystal aluminum nitride(BSC AlN)substrates are known to be ideal platforms for constructing highpower and DUV optoelectronic nitride devices.However,high-quality epitaxial growth of nitride films on BSC AlN and related characterization is still far from being well studied.The challenges and uncertainties in doing accurate thermal characterization on such heterostructures are not fully recognized.In this study,we successfully fabricated a buffer-free thin GaN/AlN heterostructure on a BSC AlN substrate via metal−organic chemical vapor deposition(MOCVD)technology.This heterostructure consists of a 140 nm-thick AlN homoepitaxial layer and a 480 nm-thick GaN epitaxial layer.Characterization results indicate that the prepared heterojunction has excellent crystal quality and smooth surface morphology.To accurately obtain the thermophysical parameters of the heterostructure,this study employed broadband frequency domain thermoreflectance(BB-FDTR)technology,and careful measurements with detailed data analysis were demonstrated.In addition to showing the feasibility of epitaxial growth of high-quality thin film GaN directly on BSC AlN substrates,this study also provides key experimental data for evaluating the heat dissipation advantages of GaN/AlN heterostructures.展开更多
A comprehensive first-principles and density functional theory study was conducted to explore the band structure,differential charge redistribution,optical properties,and photoelectric detection characteristics of PtS...A comprehensive first-principles and density functional theory study was conducted to explore the band structure,differential charge redistribution,optical properties,and photoelectric detection characteristics of PtSSe/AlN heterojunctions.The results identify the PtSSe/AlN heterojunction as a structurally stable,type-Ⅱ semiconductor,demonstrating an indirect bandgap of 1.53 eV,and representing a typical van der Waals heterojunction capable of efficient electron–hole pair separation.The internal electric field induced by the interface serves to lower the barrier height,thus promoting carrier injection.The application of strain maintains the type-Ⅱ band alignment,ensuring high stability.Meanwhile,PtSSe/AlN heterojunctions have good light-harvesting capability in the ultraviolet to visible spectrum,exhibiting three pronounced absorption peaks within the visible spectral range.The self-powered photodetector based on this heterojunction achieves high photocurrent density under different polarized lights;when the incident light energy is 2.6 e V,the maximum value of the extinction coefficient is about 14.The results indicate the device's versatility for applications,including in photoelectric detectors,optical modulators,and sensors.This research provides theoretical foundations for developing novel photodetectors,establishes a robust basis for experimental studies and device fabrication,and holds promise for advancing high-performance multifunctional optoelectronic devices.展开更多
High-temperature-annealed Al N(HTA-Al N) templates provide ideal substrates for high-quality Al Ga N epitaxy. However, the significant compressive stress accumulated within the Al Ga N layer makes it challenging to ac...High-temperature-annealed Al N(HTA-Al N) templates provide ideal substrates for high-quality Al Ga N epitaxy. However, the significant compressive stress accumulated within the Al Ga N layer makes it challenging to achieve a smooth surface free of hexagonal hillocks on these templates. To address this issue, we investigate the mechanism of compressive stress accumulation during the growth of Al Ga N-based epilayers on HTA-Al N templates using in-situ curvature analysis in this study. To verify the mechanism, a low-Al-content Al Ga N interlayer is introduced between the Al N epilayer and the subsequent Al Ga N epilayer. The larger a-plane lattice constant of this interlayer relative to the Al Ga N epilayer slows the accumulation rate of compressive stress. The hexagonal hillock can be effectively suppressed and the surface of Al Ga N epilayer can be significantly regulated by adopting various low-Al-content Al Ga N interlayers. This work provides a comprehension on the stress accumulation mechanism in Al Ga N epilayers and a feasible method to obtain hillock-free surface of Al Ga N epilayers on HTA-Al N templates,which will be beneficial for fabricating Al Ga N based devices.展开更多
Al N/Ga N high-electron-mobility transistor(HEMT)equipped with ultra-thin Al N barrier epitaxial structures were grown on 6-inch and 8-inch Si-based Ga N templates via plasma-assisted molecular beam epitaxy(PAMBE).The...Al N/Ga N high-electron-mobility transistor(HEMT)equipped with ultra-thin Al N barrier epitaxial structures were grown on 6-inch and 8-inch Si-based Ga N templates via plasma-assisted molecular beam epitaxy(PAMBE).The Al N barrier thickness was systematically optimized to improve the properties of two-dimensional electron gas(2DEG).Structural and electrical characterizations were performed by atomic force microscopy(AFM),transmission electron microscopy(TEM),contact and non-contact Hall measurements.At an optimal Al N barrier thickness,an extremely low sheet resistance of 159.9Ω/□by contact Hall and 143.8Ω/□by non-contact Hall was achieved on the 6-inch HEMT wafer,marking a significant improvement over state-of-the-art Si-based Ga N HEMTs.The epitaxial surface exhibited excellent morphology with a root-mean-square(RMS)roughness of 0.45 nm.Moreover,cross-sectional TEM analysis of PAMBE-grown Al N/Ga N HEMT revealed an atomically sharp and structurally coherent heterointerface,which is critical for achieving high electron mobility and reduced scattering loss.In addition,the 8-inch HEMT demonstrated a sheet resistance(Rs)as low as 115Ω/□by non-contact Hall with a uniformity of 2.13%,outperforming competing technologies from other companies on the market.展开更多
In this letter we report the morphological,electrical and thermal transport properties of a high electron mobility transistor(HEMT)style epitaxial wafer,where an approximately 2000 nm thick GaN layer has been directly...In this letter we report the morphological,electrical and thermal transport properties of a high electron mobility transistor(HEMT)style epitaxial wafer,where an approximately 2000 nm thick GaN layer has been directly deposited on a bulk single crystal Al N(BCS AlN)substrate with no buffer layer in between,and also the experimental results of DC and RF properties of a HEMT device based on such a wafer.The sample achieved very smooth surface morphology and roughness down to Ra=0.172 nm over an area of 1μm×1μm in AFM measurements.Electrical transport measurements showed sheet carrier concentration of 7.3×1012cm-2,Hall mobility of 2220 cm2/(V·s)and sheet resistance of 386Ω/sq.The measured maximum trans-conductance Gmof the fabricated HEMT device was 250 m S/mm at a gate bias voltage of-1.8 V.With a gate length of 500 nm and a gate-to-drain distance of 4.7μm,the f T and fmax,derived from S-parameters measurements,are 25.9 and 54 GHz,respectively.Large-signal RF measurement exhibited a high linear power gain(Gp)of 25.2 d B and a peak output power(Pout)density of 7.2 W/mm@1.5 GHz,associated with a power-added efficiency(PAE)of 40.9%.Comparing with the structure with a 500 nm thick AlGaN buffer,the total thermal resistance of the structure in our device decreased by 44%.This work confirms the technical feasibility of fabricating GaN HEMT devices on BCS AlN substrates without any additional buffer layer,and the excellent electric and thermal transport properties of the simplified wafer structure indicate a bright future of BCS Al N-based Ga N HEMT devices in ultra-high-frequency and high-power-density nitride electronics.展开更多
Achieving aluminum nitride(AlN)epilayers with dislocation densities below 107 cm-2 on sapphire remains critical for ultraviolet(UV)optoelectronics applications.However,the lattice and thermal mismatches inherent...Achieving aluminum nitride(AlN)epilayers with dislocation densities below 107 cm-2 on sapphire remains critical for ultraviolet(UV)optoelectronics applications.However,the lattice and thermal mismatches inherent to heteroepitaxial growth hinder the simultaneous suppression of threading dislocations and surface cracking.In this work,a 10.2-μm-thick,4-inch AlN film was fabricated on an AlN/sapphire substrate.A strain-modulated buffer was embedded beneath the AlN epilayer to preintroduce a well-balanced compressive strain,which counteracted tensile strain accumulation during thick-layer growth while maintaining continuous two-dimensional epitaxy for effective defect suppression.This strain management strategy,combined with progressive dislocation annihilation as the layer thickness increased,yielded a surface dislocation density of 7.6×10~6cm-2and limited cracking to within approximately 2 mm from the wafer edge.This scalable and cost-effective approach enables the growth of crack-suppressed,high-quality AlN epilayers on sapphire,offering a practical pathway for UV optoelectronic devices in light of the current limitations of bulk AlN substrates.展开更多
Surface phonon polaritons(SPhPs)exhibit promising advantages(e.g.,low loss,long lifetimes)for mid/far-infrared(MIR/FIR)nanophotonics.However,FIR SPhPs experiments remain challenging for conventional optics and scatter...Surface phonon polaritons(SPhPs)exhibit promising advantages(e.g.,low loss,long lifetimes)for mid/far-infrared(MIR/FIR)nanophotonics.However,FIR SPhPs experiments remain challenging for conventional optics and scatteringtype scanning near-field optical microscopy(s-SNOM)due to the lack of compatible light sources/detectors.In this work,we characterized~75-110 meV SPhPs in AlN nanowires using a monochromated scanning transmission electron microscope(STEM)equipped with electron energy loss spectroscopy(EELS).This technique provided exceptional 4.3 meV energy resolution and sub-angstrom spatial resolution.We observed the evolution of SPhP interference fringes with propagation distance,derived the dispersion curve,and clarified size effects on SPhP propagation by tuning AlN structure dimensions.Experimental-numerical cross-validation confirmed that the local continuum model(LCM)accurately describes AlN's SPhP behaviors.This work advances the understanding of FIR SPhPs in polar dielectrics and establishes a robust platform for studying FIR phonon polariton materials.展开更多
We have systematically studied the impact of thickness on the electrical properties of thin GaN channels on N-polar AlN(0001)templates grown on sapphire.The observed increase in sheet carrier density with increasing G...We have systematically studied the impact of thickness on the electrical properties of thin GaN channels on N-polar AlN(0001)templates grown on sapphire.The observed increase in sheet carrier density with increasing GaN thickness can be quantitatively reproduced by calculations assuming a Fermi-level pinning about 0.8 eV below the conduction band.The mobility strongly increases until 6 nm which correlates with reduced overlap of the 2DEG wave function with the surface layer.The mobility then increases more gradually up to 10 nm,corresponding to a reduced fraction of the 2DEG within the first 0.5 nm near the AlN/GaN interface,namely,the region affected by interface roughness.The mobility saturates at approximately400 cm2·V-1·s-1,probably limited by dislocations and the overlap with deep traps inside the AlN back barrier.If the GaN thickness exceeds 15 nm,the mobility decreases,likely due to the onset of gradual relaxation and appearance of misfit dislocations.Finally,we note that the temperature-dependent mobility exhibits an unexpected contribution proportional to T-2 for all GaN channels on N-polar AlN,including those reported in the literature.Such observation may be explained by a 50%higher effective mass of the electron,which amplify the electron-phonon scattering,ultimately limiting the room-temperature mobility to about 750 cm2·V-1·s-1 and confining the sheet resistivity to values above 200Ω/□.展开更多
In recent years,the development of solid-state lighting devices has increasingly shifted towards high-power laser illumination,making it imperative to develop fluorescent conversion materials with exceptional thermal ...In recent years,the development of solid-state lighting devices has increasingly shifted towards high-power laser illumination,making it imperative to develop fluorescent conversion materials with exceptional thermal stability and luminous quality.In this study,we introduced a highly reflective TiO2 substrate in combination with a high thermal conductivity AlN substrate to design a Ce:YAG-PiG-TiO2-AlN Film(Ce:YAG PTAF)color converter with outstanding photothermal performance.Remarkably,the thermal conductivity of this material reaches 48.28 W m-1 K-1.Notably,the optimized PTAF can withstand a high-power output of up to 12.14 W in a static environment,with a maximum luminous flux(LFmax)of 2284.6 lm and maximum luminous efficacy(LEmax)of 222.35 lm W-1,showcasing its excellent optical properties.Furthermore,the fabricated Ce:YAG-PiG-TiO2-AlN-Wheel(Ce:YAG PTAW),equipped with a motor operating at 7200 r/min,emits an extraordinary brightness of 4404 lm under 88 W of ultra-high laser irradiation,with stability surpassing that of commercial silicone color wheels,thanks to its superior Li2O-Al2O3-SiO2(LAS)glass system.Interestingly,we designed an innovative spatially separated two-color segmented wheel structure,effectively mitigating the photon reabsorption phenomenon caused by the overlap of the fluorescent powder absorption peaks.When the ratio of Ce:YAG to Ce:GdYAG is 240:120,it yields white light with a color rendering index(CRI)of 80.2,and luminous flux remaining at 3317.8 lm.When encapsulated in a reflective module,it accurately reflects the true color states of objects.These results collectively indicate that both Ce:YAG PTAF and PTAW possess significant application potential in the realm of high-power laser illumination.展开更多
基金supported by the Innovation Research Foundation of National University of Defense Technology,P.R.China,with the Grant No.24-ZZCX-ZXGC-01.
摘要Bulk single-crystal aluminum nitride(BSC AlN)substrates are known to be ideal platforms for constructing highpower and DUV optoelectronic nitride devices.However,high-quality epitaxial growth of nitride films on BSC AlN and related characterization is still far from being well studied.The challenges and uncertainties in doing accurate thermal characterization on such heterostructures are not fully recognized.In this study,we successfully fabricated a buffer-free thin GaN/AlN heterostructure on a BSC AlN substrate via metal−organic chemical vapor deposition(MOCVD)technology.This heterostructure consists of a 140 nm-thick AlN homoepitaxial layer and a 480 nm-thick GaN epitaxial layer.Characterization results indicate that the prepared heterojunction has excellent crystal quality and smooth surface morphology.To accurately obtain the thermophysical parameters of the heterostructure,this study employed broadband frequency domain thermoreflectance(BB-FDTR)technology,and careful measurements with detailed data analysis were demonstrated.In addition to showing the feasibility of epitaxial growth of high-quality thin film GaN directly on BSC AlN substrates,this study also provides key experimental data for evaluating the heat dissipation advantages of GaN/AlN heterostructures.
基金supported by the National Natural Science Foundation of China Youth Fund(Grant No.12104362)the Shaanxi Provincial Innovative Talent Promotion Program—Youth Science and Technology Rising Star Project(Grant No.2022KJXX-61)。
摘要A comprehensive first-principles and density functional theory study was conducted to explore the band structure,differential charge redistribution,optical properties,and photoelectric detection characteristics of PtSSe/AlN heterojunctions.The results identify the PtSSe/AlN heterojunction as a structurally stable,type-Ⅱ semiconductor,demonstrating an indirect bandgap of 1.53 eV,and representing a typical van der Waals heterojunction capable of efficient electron–hole pair separation.The internal electric field induced by the interface serves to lower the barrier height,thus promoting carrier injection.The application of strain maintains the type-Ⅱ band alignment,ensuring high stability.Meanwhile,PtSSe/AlN heterojunctions have good light-harvesting capability in the ultraviolet to visible spectrum,exhibiting three pronounced absorption peaks within the visible spectral range.The self-powered photodetector based on this heterojunction achieves high photocurrent density under different polarized lights;when the incident light energy is 2.6 e V,the maximum value of the extinction coefficient is about 14.The results indicate the device's versatility for applications,including in photoelectric detectors,optical modulators,and sensors.This research provides theoretical foundations for developing novel photodetectors,establishes a robust basis for experimental studies and device fabrication,and holds promise for advancing high-performance multifunctional optoelectronic devices.
基金supported by the National Key R&D Program of China (Grant No. 2022YFB3605000)the National Natural Science Foundation of China (Nos. 62004127, 61725403, 62121005, 61922078, 61827813, and 62004196)+1 种基金the Youth Innovation Promotion Association of Chinese Academy of Sciencesthe Youth Talent Promotion Project of the Chinese Institute of Electronics (No. 2020QNRC001)。
摘要High-temperature-annealed Al N(HTA-Al N) templates provide ideal substrates for high-quality Al Ga N epitaxy. However, the significant compressive stress accumulated within the Al Ga N layer makes it challenging to achieve a smooth surface free of hexagonal hillocks on these templates. To address this issue, we investigate the mechanism of compressive stress accumulation during the growth of Al Ga N-based epilayers on HTA-Al N templates using in-situ curvature analysis in this study. To verify the mechanism, a low-Al-content Al Ga N interlayer is introduced between the Al N epilayer and the subsequent Al Ga N epilayer. The larger a-plane lattice constant of this interlayer relative to the Al Ga N epilayer slows the accumulation rate of compressive stress. The hexagonal hillock can be effectively suppressed and the surface of Al Ga N epilayer can be significantly regulated by adopting various low-Al-content Al Ga N interlayers. This work provides a comprehension on the stress accumulation mechanism in Al Ga N epilayers and a feasible method to obtain hillock-free surface of Al Ga N epilayers on HTA-Al N templates,which will be beneficial for fabricating Al Ga N based devices.
基金supported by the National Natural Science Foundation of China(Grant No.52473331)Hubei Provincial Technological Innovation Program(Grant Nos.2025BAB043 and 2025BAB104)partially supported by Open Project Funding of the Key Laboratory of Intelligent Sensing System and Security(Ministry of Education)。
摘要Al N/Ga N high-electron-mobility transistor(HEMT)equipped with ultra-thin Al N barrier epitaxial structures were grown on 6-inch and 8-inch Si-based Ga N templates via plasma-assisted molecular beam epitaxy(PAMBE).The Al N barrier thickness was systematically optimized to improve the properties of two-dimensional electron gas(2DEG).Structural and electrical characterizations were performed by atomic force microscopy(AFM),transmission electron microscopy(TEM),contact and non-contact Hall measurements.At an optimal Al N barrier thickness,an extremely low sheet resistance of 159.9Ω/□by contact Hall and 143.8Ω/□by non-contact Hall was achieved on the 6-inch HEMT wafer,marking a significant improvement over state-of-the-art Si-based Ga N HEMTs.The epitaxial surface exhibited excellent morphology with a root-mean-square(RMS)roughness of 0.45 nm.Moreover,cross-sectional TEM analysis of PAMBE-grown Al N/Ga N HEMT revealed an atomically sharp and structurally coherent heterointerface,which is critical for achieving high electron mobility and reduced scattering loss.In addition,the 8-inch HEMT demonstrated a sheet resistance(Rs)as low as 115Ω/□by non-contact Hall with a uniformity of 2.13%,outperforming competing technologies from other companies on the market.
基金supported by the Innovation Research Foundation of National University of Defense Technology,P.R.China,with the Grant No.24-ZZCX-ZXGC-01。
摘要In this letter we report the morphological,electrical and thermal transport properties of a high electron mobility transistor(HEMT)style epitaxial wafer,where an approximately 2000 nm thick GaN layer has been directly deposited on a bulk single crystal Al N(BCS AlN)substrate with no buffer layer in between,and also the experimental results of DC and RF properties of a HEMT device based on such a wafer.The sample achieved very smooth surface morphology and roughness down to Ra=0.172 nm over an area of 1μm×1μm in AFM measurements.Electrical transport measurements showed sheet carrier concentration of 7.3×1012cm-2,Hall mobility of 2220 cm2/(V·s)and sheet resistance of 386Ω/sq.The measured maximum trans-conductance Gmof the fabricated HEMT device was 250 m S/mm at a gate bias voltage of-1.8 V.With a gate length of 500 nm and a gate-to-drain distance of 4.7μm,the f T and fmax,derived from S-parameters measurements,are 25.9 and 54 GHz,respectively.Large-signal RF measurement exhibited a high linear power gain(Gp)of 25.2 d B and a peak output power(Pout)density of 7.2 W/mm@1.5 GHz,associated with a power-added efficiency(PAE)of 40.9%.Comparing with the structure with a 500 nm thick AlGaN buffer,the total thermal resistance of the structure in our device decreased by 44%.This work confirms the technical feasibility of fabricating GaN HEMT devices on BCS AlN substrates without any additional buffer layer,and the excellent electric and thermal transport properties of the simplified wafer structure indicate a bright future of BCS Al N-based Ga N HEMT devices in ultra-high-frequency and high-power-density nitride electronics.
基金supported by the National Key R&D Program of China(No.2022YFE0140100),the National Key R&D Program of China(No.2024YFE0205100)the National Natural Science Foundation of China(Nos.62321004,52273271,and 62471011)the Postdoctoral Fellowship Program of China Postdoctoral Science Foundation(No.GZC20250358),and 2024TX08C270。
摘要Achieving aluminum nitride(AlN)epilayers with dislocation densities below 107 cm-2 on sapphire remains critical for ultraviolet(UV)optoelectronics applications.However,the lattice and thermal mismatches inherent to heteroepitaxial growth hinder the simultaneous suppression of threading dislocations and surface cracking.In this work,a 10.2-μm-thick,4-inch AlN film was fabricated on an AlN/sapphire substrate.A strain-modulated buffer was embedded beneath the AlN epilayer to preintroduce a well-balanced compressive strain,which counteracted tensile strain accumulation during thick-layer growth while maintaining continuous two-dimensional epitaxy for effective defect suppression.This strain management strategy,combined with progressive dislocation annihilation as the layer thickness increased,yielded a surface dislocation density of 7.6×10~6cm-2and limited cracking to within approximately 2 mm from the wafer edge.This scalable and cost-effective approach enables the growth of crack-suppressed,high-quality AlN epilayers on sapphire,offering a practical pathway for UV optoelectronic devices in light of the current limitations of bulk AlN substrates.
基金supported by the National Key R&D Program of China(Grant No.2023YFB3609903)the National Natural Science Foundation of China(Grant Nos.52125307and 12404192)+1 种基金the“2011 Program”from the Peking–Tsinghua–IOP Collaborative Innovation Center of Quantum Mattersupport from the New Cornerstone Science Foundation through the XPLORER PRIZE。
摘要Surface phonon polaritons(SPhPs)exhibit promising advantages(e.g.,low loss,long lifetimes)for mid/far-infrared(MIR/FIR)nanophotonics.However,FIR SPhPs experiments remain challenging for conventional optics and scatteringtype scanning near-field optical microscopy(s-SNOM)due to the lack of compatible light sources/detectors.In this work,we characterized~75-110 meV SPhPs in AlN nanowires using a monochromated scanning transmission electron microscope(STEM)equipped with electron energy loss spectroscopy(EELS).This technique provided exceptional 4.3 meV energy resolution and sub-angstrom spatial resolution.We observed the evolution of SPhP interference fringes with propagation distance,derived the dispersion curve,and clarified size effects on SPhP propagation by tuning AlN structure dimensions.Experimental-numerical cross-validation confirmed that the local continuum model(LCM)accurately describes AlN's SPhP behaviors.This work advances the understanding of FIR SPhPs in polar dielectrics and establishes a robust platform for studying FIR phonon polariton materials.
基金supported by JST SPRING,Japan Grant Number JPMJSP2125。
摘要We have systematically studied the impact of thickness on the electrical properties of thin GaN channels on N-polar AlN(0001)templates grown on sapphire.The observed increase in sheet carrier density with increasing GaN thickness can be quantitatively reproduced by calculations assuming a Fermi-level pinning about 0.8 eV below the conduction band.The mobility strongly increases until 6 nm which correlates with reduced overlap of the 2DEG wave function with the surface layer.The mobility then increases more gradually up to 10 nm,corresponding to a reduced fraction of the 2DEG within the first 0.5 nm near the AlN/GaN interface,namely,the region affected by interface roughness.The mobility saturates at approximately400 cm2·V-1·s-1,probably limited by dislocations and the overlap with deep traps inside the AlN back barrier.If the GaN thickness exceeds 15 nm,the mobility decreases,likely due to the onset of gradual relaxation and appearance of misfit dislocations.Finally,we note that the temperature-dependent mobility exhibits an unexpected contribution proportional to T-2 for all GaN channels on N-polar AlN,including those reported in the literature.Such observation may be explained by a 50%higher effective mass of the electron,which amplify the electron-phonon scattering,ultimately limiting the room-temperature mobility to about 750 cm2·V-1·s-1 and confining the sheet resistivity to values above 200Ω/□.
基金financially supported by the National Natural Science Foundation of China(No.1237040868).
摘要In recent years,the development of solid-state lighting devices has increasingly shifted towards high-power laser illumination,making it imperative to develop fluorescent conversion materials with exceptional thermal stability and luminous quality.In this study,we introduced a highly reflective TiO2 substrate in combination with a high thermal conductivity AlN substrate to design a Ce:YAG-PiG-TiO2-AlN Film(Ce:YAG PTAF)color converter with outstanding photothermal performance.Remarkably,the thermal conductivity of this material reaches 48.28 W m-1 K-1.Notably,the optimized PTAF can withstand a high-power output of up to 12.14 W in a static environment,with a maximum luminous flux(LFmax)of 2284.6 lm and maximum luminous efficacy(LEmax)of 222.35 lm W-1,showcasing its excellent optical properties.Furthermore,the fabricated Ce:YAG-PiG-TiO2-AlN-Wheel(Ce:YAG PTAW),equipped with a motor operating at 7200 r/min,emits an extraordinary brightness of 4404 lm under 88 W of ultra-high laser irradiation,with stability surpassing that of commercial silicone color wheels,thanks to its superior Li2O-Al2O3-SiO2(LAS)glass system.Interestingly,we designed an innovative spatially separated two-color segmented wheel structure,effectively mitigating the photon reabsorption phenomenon caused by the overlap of the fluorescent powder absorption peaks.When the ratio of Ce:YAG to Ce:GdYAG is 240:120,it yields white light with a color rendering index(CRI)of 80.2,and luminous flux remaining at 3317.8 lm.When encapsulated in a reflective module,it accurately reflects the true color states of objects.These results collectively indicate that both Ce:YAG PTAF and PTAW possess significant application potential in the realm of high-power laser illumination.